Next Generation of Internet of Things : proceedings of ICNGIoT 2022 / ed. Reghvendra Kumar, Prasant Kumar Pattnaik, João Manuel R. S. Tavares. - Singapore : Springer, cop. 2023. - XXII, 713 p. : il. ; 24 cm.
ISBN - 978-981-19-1411-9
This short and focused book provides a description of the fundamentals of adhesive bonding within the field of aerospace applications, aimed at engineering master degree students and all those who wish to learn more about this technology. It highlights the foundations behind the use of adhesive bonding, always within the context of aeronautical cases of use. The book is written to be easily accessible to those with limited knowledge in the field and includes many illustrations to facilitate the comprehension of the concepts exposed. The work is divided into nine chapters, including theory of adhesion, surface preparation, adhesive formulations, joint manufacturing processes, quality control, repair and durability.
This book includes selected papers from the International Conference on Next Generation of Internet of Things (ICNGIoT 2022), organized by Department of Computer Science and Engineering, School of Engineering, GIET University, Gunupur, Odisha, India, during February 3–4, 2022.